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IEC 63251:2023

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

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Kehtiv alates 01.11.2023
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Staatus
Kuupäev
Tüüp
Nimetus
01.11.2023
Põhitekst
IEC 63251:2023 defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

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