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EVS-EN IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

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Kehtiv alates 16.07.2019
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IEC 61188-6-4:2019; EN IEC 61188-6-4:2019
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16.07.2019
Põhitekst
This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series.
This document is applicable to the SMD of semiconductor devices and electrical components.

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EVS-EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Uusim versioon Kehtiv alates 01.04.2021
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EVS-EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
Uusim versioon Kehtiv alates 15.04.2021