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EVS-EN 61191-6:2010

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

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Kehtiv alates 07.06.2010
Alusdokumendid
IEC 61191-6:2010; EN 61191-6:2010
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Kuupäev
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Nimetus
07.06.2010
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This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board.

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EVS-EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Uusim versioon Kehtiv alates 01.11.2017
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EVS-EN IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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