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EVS-EN 61191-1:2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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Kehtetu alates 16.11.2018
Alusdokumendid
IEC 61191-1:2013; EN 61191-1:2013
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Standardi ajalugu

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Kuupäev
Tüüp
Nimetus
16.11.2018
Põhitekst
07.10.2013
Põhitekst
Põhitekst
EVS-EN 61191-1:2002
IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - reference standard IEC 61192-1 has been replaced by IPC-A-610; - some of the terminology has been updated; - references to IEC standards have been corrected; - the use of lead-free alloys in the assembly have been added.

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EVS-EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Uusim versioon Kehtiv alates 01.11.2017
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EVS-EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Uusim versioon Kehtiv alates 18.09.2017
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EVS-EN 61191-4:2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Uusim versioon Kehtiv alates 01.11.2017