Back

EVS-EN 62047-11:2013

Semiconductor devices - Micro-electromechanical devices -- Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

General information

Valid from 14.11.2013
Base Documents
IEC 62047-11:2013; EN 62047-11:2013
ICS Groups
31.080.99 Other semiconductor devices
Directives or regulations
None

Standard history

Status
Date
Type
Name
14.11.2013
Main
EVS-EN 62047-11:2013
IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material's melting temperature.

Required fields are indicated with *

*
*
*
PDF
19.52 € incl tax
Paper
19.52 € incl tax
Browse standard from 2.44 € incl tax
Standard monitoring
English (PDF 261 KB)

Related products

Main + amendment

EVS-EN IEC 62031:2020+A11:2021

LED modules for general lighting - Safety specifications (IEC 62031:2018)
Newest version Valid from 31.12.2021
Main

EVS-EN IEC 62031:2020

LED modules for general lighting - Safety specifications (IEC 62031:2018)
Valid from 02.04.2020
Main + amendment

EVS-EN 62031:2008+A1:2013+A2:2015

LED modules for general lighting - Safety specifications
Withdrawn from 02.04.2020
Main

EVS-EN IEC 62384:2020

DC or AC supplied electronic controlgear for LED modules - Performance requirements
Newest version Valid from 16.07.2020

Customers who bought this item also bought

Main

EVS-EN 62047-17:2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Newest version Valid from 05.08.2015
Main

EVS-EN 62047-16:2015

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
Newest version Valid from 05.08.2015
Main

EVS-EN 62047-18:2013

Semiconductor devices - Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials
Newest version Valid from 14.11.2013
Main

EVS-EN 62047-19:2013

Semiconductor devices - Micro-electromechanical devices -- Part 19: Electronic compasses
Newest version Valid from 14.11.2013

Standards designation

EVS Estonian standard
EN European standard (published by an CEN or CENELEC)
EN ISO International standard adopted as an European standard
ISO International Organization for Standardization’s standard
IEC International Electrotechnical Commission’s standard
HD CENELEC’s harmonisation document
   
EVS-EN European standard implemented in Estonia
EVS-EN ISO International standard adopted in Europe and implemented in Estonia
EVS-EN ISO/IEC International standard/International electrotechnical standard adopted in Europe and implemented in Estonia
EVS-IEC International electrotechnical standard implemented in Estonia
EVS-ISO International standard implemented in Estonia
   
A, AMD amedment
+A a full standard plus the amendment
/A only amendment
COR, AC corrigendum
+COR a full standard plus the corrigendum
NA national annex
+NA a full standard plus the national annex
/NA only national annex
TS technical specification
TR technical report
CWA agreement, developed by a CEN or CENELEC
prEVS-EN (etc) draft standard
   
et the standard is in Estonian only
en the standard is in English only
et-en the standard is in Parallel text Estonian-English