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EVS-EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

General information

Valid from 18.09.2017
Base Documents
IEC 61191-3:2017; EN 61191-3:2017
Directives or regulations
None

Standard history

Status
Date
Type
Name
18.09.2017
Main
01.01.2003
Main
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

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