Back

EVS-EN 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

General information

Valid from 18.09.2017
Base Documents
IEC 61191-3:2017; EN 61191-3:2017
ICS Groups
31.240 Mechanical structures for electronic equipment
Directives or regulations
None

Standard history

Status
Date
Type
Name
18.09.2017
Main
EVS-EN 61191-3:2017
01.01.2003
Main
EVS-EN 61191-3:2002
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Required fields are indicated with *

*
*
*
PDF
19.52 € incl tax
Paper
19.52 € incl tax
Browse standard from 2.44 € incl tax
Standard monitoring
English (PDF 359 KB)

Related products

Main

EVS-EN 60297-3-100:2009

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets
Newest version Valid from 05.03.2009
Main

EVS-EN 60297-3-101:2004

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3-101: Subracks and associated plug-in units
Newest version Valid from 10.12.2004
Main

EVS-EN IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Newest version Valid from 16.11.2018
Main

EVS-EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Newest version Valid from 01.11.2017

Customers who bought this item also bought

Main

EVS-EN 61191-4:2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Newest version Valid from 01.11.2017
Main

EVS-EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Newest version Valid from 01.11.2017
Main

EVS-EN IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Newest version Valid from 16.11.2018
Main

EVS-EN ISO 14155:2020

Clinical investigation of medical devices for human subjects - Good clinical practice (ISO 14155:2020)
Newest version Valid from 02.10.2020

Standards designation

EVS Estonian standard
EN European standard (published by an CEN or CENELEC)
EN ISO International standard adopted as an European standard
ISO International Organization for Standardization’s standard
IEC International Electrotechnical Commission’s standard
HD CENELEC’s harmonisation document
   
EVS-EN European standard implemented in Estonia
EVS-EN ISO International standard adopted in Europe and implemented in Estonia
EVS-EN ISO/IEC International standard/International electrotechnical standard adopted in Europe and implemented in Estonia
EVS-IEC International electrotechnical standard implemented in Estonia
EVS-ISO International standard implemented in Estonia
   
A, AMD amedment
+A a full standard plus the amendment
/A only amendment
COR, AC corrigendum
+COR a full standard plus the corrigendum
NA national annex
+NA a full standard plus the national annex
/NA only national annex
TS technical specification
TR technical report
CWA agreement, developed by a CEN or CENELEC
prEVS-EN (etc) draft standard
   
et the standard is in Estonian only
en the standard is in English only
et-en the standard is in Parallel text Estonian-English