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EVS-EN 61191-3:2002

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

General information

Withdrawn from 18.09.2017
Base Documents
IEC 61191-3:1998; EN 61191-3:1998
Directives or regulations
None

Standard history

Status
Date
Type
Name
18.09.2017
Main
01.01.2003
Main
This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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