IEC 60748-20:1988

Applies to film integrated circuits and to hybrid film integrated
circuits both passive and active. Applies also to partly-completed
F and HFICs supplied to customers for subsequent processing as well
as to chip carrier circuits having more than one chip, provided
that they have been interconnected by film interconnection
techniques.
This specification defines the quality assessment procedures and
the methods for electrical, climatic, mechanical and endurance
tests. It outlines the requirements which shall be applied to the
release of circuits using either qualification approval procedures
or capability approval procedures.