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EVS-EN IEC 61188-6-4:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

General information

Valid from 16.07.2019
Base Documents
IEC 61188-6-4:2019; EN IEC 61188-6-4:2019
Directives or regulations
None

Standard history

Status
Date
Type
Name
16.07.2019
Main
This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series.
This document is applicable to the SMD of semiconductor devices and electrical components.

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