Skip to main content
Back

EVS-EN 62047-21:2014

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

General information

Valid from 07.11.2014
Base Documents
EN 62047-21:2014; IEC 62047-21:2014
Directives or regulations
None

Standard history

Status
Date
Type
Name
07.11.2014
Main
IEC 62047-21:2014 specifies the determination of Poisson's ratio from the test results obtained by the application of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 µm.

Required fields are indicated with *

*
*
*
PDF
15.86 € incl tax
Paper
15.86 € incl tax
Browse standard from 2.44 € incl tax
Standard monitoring

Customers who bought this item also bought

Main

EVS-EN 62047-26:2016

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Newest version Valid from 03.05.2016
Main

EVS-EN 62047-25:2016

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Newest version Valid from 06.12.2016
Main

EVS-EN 62047-22:2014

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Newest version Valid from 07.11.2014
Amendment

EVS-EN 60747-16-4:2004/A2:2017

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
Newest version Valid from 01.12.2017