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EVS-EN 61188-5-1:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

General information

Withdrawn from 15.04.2021
Base Documents
IEC 61188-5-1:2002; EN 61188-5-1:2002
Directives or regulations
None

Standard history

Status
Date
Type
Name
15.04.2021
Main
01.03.2003
Main
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

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